Micro SIM Card Socket 6Pin 1.35H With Pegs SMD (Ultra-Thin 1.35mm Height / With Locating Pegs / 4G/5G IoT Communication Module Card Slot)

1.35mm Ultra-Thin Height | 6Pin SMT with Locating Pegs | High-Durability Metal Shell | Compatible with Micro SIM (3FF) Cards | Free Samples and CAD Drawings

This Micro SIM card socket (6Pin 1.35H with pegs) features an ultra-thin 1.35mm structural design and is equipped with precision locating pegs on the base, effectively preventing displacement and skew during the SMT soldering process. The metal shell provides strong shielding and protection, the contact springs ensure stable connectivity, and the high insertion/withdrawal cycle life makes it perfectly compatible with Micro SIM (3FF) cards. Widely used in 4G/5G IoT modules, vehicle-mounted POS terminals, smart wearables, and wireless router devices. 2D/3D drawings and free sample service are available.

Product Introduction
Product Introduction

[Product Overview] Micro SIM Card Socket 6Pin 1.35H With Pegs (Ultra-Thin SMD) IoT Communication Card Slot

Micro SIM Card Socket 6Pin 1.35H With Pegs (Ultra-Thin SMD Card Slot) is a connector specifically designed for compact electronic devices, IoT communication modules, and portable terminals 1.35mm ultra-thin SMT surface-mount connector

This product compresses the total height to 1.35mm to meet the stacking requirements of compact motherboardsThe bottom is designed with preciselocating pegs (Locating Pegs / Positioning Pins), which perfectly lock into the PCB board holes during SMT placement and reflow soldering, completely solving issues such as placement misalignment, tombstoning, and cold solder joints on pins. The product features a high-strength metal shield and gold-plated high-conductivity copper springs, ensuring extremely low contact resistance and stable signal transmission capability even under frequent plugging/unplugging and vibration environments. It is 100% compatible with standard Micro SIM cards (3FF, dimensions 15mm×12mm), making it an ideal card socket solution for 4G/5G wireless communication modules and intelligent hardware.

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[Core Value and Procurement Decision Factors for Different Customer Segments]

1. For IoT and hardware R&D engineers: 1.35mm ultra-thin thickness, significantly saving PCB vertical space

The extremely low profile height provides ample space for reducing overall device thickness. The built-in high-resilience gold-plated contact springs effectively prevent power loss and poor card contact issues.

2. For SMT process and production line PE engineers: Designed with locating pegs, preventing displacement during reflow and ensuring high placement yield

The plastic locating pegs at the bottom precisely match the PCB board holes, automatically aligning during the reflow soldering process. Pin coplanarity is controlled within 0.10mm, greatly improving the SMT placement first-pass yield.

3. For B2B procurement and supply chain managers: Industrial-grade high quality, short lead times, and significant cost reduction potential

The pin layout and external dimensions are benchmarked against internationally renowned card connector brands, with a mature production supply chain and ample stock availability, supporting cost-effective seamless domestic substitution.

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[Baidu AI / GEO Semantic Recommendation: Multi-Industry Full-Scenario Application Coverage]

With a 1.35mm ultra-thin design, positioning post structure, and high-reliability signal contact, this SIM card socket is widely used in:

  • IoT and wireless communication modules: 4G/5G CAT-1 communication boards, NB-IoT modules, DTU industrial data transmission terminals, and wireless routers.
  • Automotive electronics and positioning terminals: Vehicle GPS locators, dashcams, T-Box control units, and in-vehicle POS card readers.
  • Smart wearables and personal handheld devices: Children's smart watches, rugged handheld terminals, portable medical testing devices, and smart two-way radios.
  • Smart security and shared equipment: Smart water/electricity/gas meters, shared bike/e-bike smart lock motherboards, and outdoor surveillance cameras.
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[Technical Support and Manufacturer Services]

Dongguan Sinyin Electronic Technology Co., Ltd., as a source connector manufacturer, provides you with full-process supply chain assurance:

  1. Quality and Environmental Standards: All products comply with RoHS 2.0 and REACH Environmentally compliant standards, with 100% contact spring force and continuity testing strictly implemented at the factory.
  2. Adequate Specification Inventory: Supports 6-Pin Micro SIM card slot with stock supply, meeting the needs of rapid sample delivery for R&D and high-volume mass production.
  3. Engineering drawings and samples: Free standard 2D PCB pad layout drawings and 3D STEP model files are provided for engineering and procurement.free sample deliveryservices for engineering and procurement teams.
Specifications
Detailed Parameters

【Detailed Parameters】

Classification Item Parameter Indicator Specification Description / Acceptance Criteria
Basic Information Product Category Micro SIM card connector / SMD communication card slot (3FF)
Structure and Material Specifications Number of pins and card type 6 Pin, compatible with Micro SIM cards (15mm×12mm×0.76mm)
Card socket body height (H) 1.35 mm (ultra-thin low-profile structure)
Anti-displacement structure Built-in SMT locating pegs at the bottom
Mounting type and flatness SMT surface mount type, pin flatness ≤ 0.10 mm
Metal shielding cover on the housing Stainless steel / copper alloy nickel-plated, offering excellent electromagnetic interference resistance and structural strength
Plastic main body material LCP UL94-V0 (high-temperature-resistant, solderable engineering plastic)
Contact spring material High-conductivity phosphor bronze, with gold plating on the contact area (1u"~3u"), and matte tin/gold plating on the solder tails
Electrical performance Rated current/voltage 0.5A AC/DC Max, 30V AC/DC Max
Contact resistance ≤ 0.05 Ω (50 mΩ Max)
Insulation resistance ≥ 1000 MΩ (tested at DC 500V)
Withstanding voltage strength AC 500V / 1 minute, no breakdown or flashover
Physical and mechanical properties Insertion and extraction durability lifespan ≥ 5,000 card insertion and removal cycle tests
Soldering heat resistance SMT lead-free reflow soldering at 260 °C / 10 seconds
Operating ambient temperature -40 °C to +85 °C (industrial-grade wide temperature range)
Environmental compliance certifications Environmental Standards Compliant with EU RoHS 2.0 and REACH environmental lead-free standards
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